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| Academic Studies | |
| 10/2008 | Scholarship holder of the Integrated PhD Program of the IGP H-C3
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| 07/2006 - 09/2008 | Research scientist at the Fraunhofer Institute for Reliability and Microintegration, Department "System Integration and Interconnection Technologies", Group "Interconnect Metallurgy and Processes"
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| 06/2006 | Graduation with the degree Diplom-Ingenieurin of the TU Berlin with distinction and the degree Diplôme d'Ingénieur des Arts et Manufactures of the Ecole Centrale Paris
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| During the studies internships at Philips Forschungslaboratorien Aachen, Forschungszentrum Jülich and Philips Medical Systems Hamburg were completed |
| 10/2000 - 06/2006 | Studies of electrical engineering and information engineering at the RWTH Aachen, the TU Berlin as well as the Ecole Centrale Paris within the double degree program T.I.M.E. |
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| Work Group |
Berlin Center of Advanced Packaging |
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| Advisors |
Prof. Dr.-Ing. Dr.-Ing. E.h. Herbert Reichl |
| Prof. Dr.-Ing Clemens Gühmann |
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| Preliminary Title |
Eliability evaluation of gold and gold-tin micro-contacts in regard to the degradation due to electromigration |
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