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| Academic Studies | |
| 10/2007 - | Postgraduate Student in the IGP H-C3 at Technische Universität Berlin
|
| 10/2002 - 08/2007 | Studies on Electrical Engineering at Technischen Universität Berlin
Degree: Diplom-Ingenieur
Major subjects: Packaging of Electronic Systems, Communication Systems and Microelectronics |
| 09/2005 - 05/2006 | Studies on Electrical Engineering at University of Massachusetts Amherst, USA |
|
| Professional Experience / Internships |
Technische Universität Berlin
Berlin Center of Advanced Packaging (Berlin) |
| Fraunhofer Institut für Zuverlässigkeit und Mikrointegration (Berlin) |
| Siemens AG (Berlin) |
| Theapro Planungsgesellschaft mbH (München) |
|
| Professional Education |
SAE Institute, Audio Engineer (München) |
|
| Awards |
Erwin-Stephan-Preis der TU-Berlin (2008) |
| DAAD-ISAP Stipendium (2005/2006) |
|
| Research Interests |
Reliability, Lifetime Prediction and Condition Indication of Electronic Systems |
| Finite - Elemente - Analysis of Combined Loadings |
|
| Work Group |
Berlin Center of Advanced Packaging |
|
| Advisors |
Prof. Dr.-Ing. Dr.-Ing. E.h. Herbert Reichl |
| Prof. Dr.-Ing. Clemens Gühmann |
|
| Publications |
"Condition Indicators for Reliability Monitoring of Microsystems", T. Eckert, O. Bochow-Neß, A.Middendorf, K.Tetzner and H.Reichl, 2nd Electronics Systemintegration Technology Conference, Proceedings of the, Greenwich, UK, 2008, pp. 1035-1040 |
| "Condition Monitoring of Microsystems Supporting Sustainability", O. Bochow-Neß, T. Eckert, N.-F. Nissen, J. Jaeschke, A. Middendorf, H. Reichl, Electronic Goes Green 2008+ Proceedings, Berlin, Germany, 2008, pp. 219-224 |
