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Integrated Graduate Program
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Johannes Jaeschke
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| Academic Studies | |
| 11/2007 - | Postgraduate Student in the IGP H-C3 at Technische Universität Berlin |
| 10/2001 - 10/2007 | Studies on Electrical Engineering at Technischen Universität Berlin Main focuses: Microsystem-Technologies, Communication Systems, Electronics |
| Professional Experience | |
| 04/2007 - 10/2007 | Working student (thesis) Hella KGaA Hueck & Co. |
| 01/2005 - 10/2007 | Working student, Technische Universität Berlin, Forschungsschwerpunkt Technologien der Mikroperipherik, department "Sustainable Technologies" |
| 01/2004 - 12/2004 | Working student, Fraunhofer Institute for Reliability and Microintegration |
| Research Interests | Electromigration in solder joints |
| Modeling, lifetime estimation and reliability of electronic systems | |
| Sustainable Electronics | |
| Work Group | Berlin Center of Advanced Packaging |
| Advisors | Prof. Dr.-Ing. Dr.-Ing. E.h. Herbert Reichl |
| Prof. Dr.-Ing. Clemens Gühmann | |
| Veröffentlichungen | "Condition Monitoring of Microsystems Supporting Sustainability", O. Bochow-Neß, T. Eckert, N.-F. Nissen, J. Jaeschke, A. Middendorf, H. Reichl, Electronic Goes Green 2008+ Proceedings, Berlin, Germany, 2008, pp. 219-224 |
| "Präventive Ansätze zur zuverlässigkeitsorientierten Produktentwicklung", J. Jaeschke, A. Middendorf, D. Steffen, Zeitschrift für wirtschaftlichen Fabrikbetrieb, 7-8/2008, 103. Jahrgang, pp. 544-548 | |
| "Reliability and Environmental Evaluation in Early Design Stages of Mechatronics", J. Jaeschke, A. Middendorf, K. Tsunezawa, H. Reichl, 7th International Heinz Nixdorf Symposium: Self-optimizing Mechatronic Systems: Design the Future, 2008, Paderborn, Germany, pp. 143-154 |
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